MicroLED chip preparation process

88 views admin 2023-09-15

As with LED displays, MicroLED chips are generally prepared by etching and Epitaxy (also known as epitaxy). The chip manufacturing process mainly includes the following steps:

01 Substrate preparation
Substrate preparation: After cleaning sapphire substrate with organic solvent and acid solution, graphic sapphire substrate is prepared by dry etching.
02 Intermediate layer preparation
The intermediate layer is prepared by using MOCVD for gas phase epitaxy, and GaN buffer layer, N-type GaN layer, multi-layer quantum well and P-type GaN layer are grown respectively under high temperature conditions.
03 step etching
Step etching, patterned photoresist is formed on the surface of epitaxial sheet, and then etched to N-type GaN layer by inductively coupled plasma etching (ICP) process.
04 Preparation of conductive layer
The conductive layer is prepared by sputtering indium tin oxide (ITO) on the surface of the sample, and the graphic ITO conductive layer is formed by photolithography. The insulation layer is prepared by plasma enhanced chemical vapor deposition (PECVD) to form SiO2 insulation layer, which is then photolithography and wet etching.
05 Electrode preparation
The electrode was prepared, and the graphic photoresist was prepared by stripping method, etc. After the electron beam evaporated Au, the photoresist was stripped by high-pressure stripping machine.
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