What raw materials are needed for LED lamp bead packaging

6 views admin 2025-07-25

In LED display technology, LED packaging plays a vital role. Different raw materials determine the performance and quality of LED packaging. This article discusses the various raw materials used in LED packaging, including LED brackets, LED chips, solid crystal glue, bonding wires and packaging glue, etc., to fully understand their specific classification and performance characteristics, as well as their important role in LED packaging.

LED brackets are usually made of copper (also iron, aluminum and ceramic, etc.), and are widely used because of their good conductivity. There are leads inside the bracket to connect the internal electrodes of the LED lamp beads. After the package is formed, the lamp beads can be removed from the bracket, and the copper feet at both ends of the lamp beads become positive and negative poles, which are convenient for welding to LED lamps or other finished products

LED brackets can be classified in different ways: According to product type, they are divided into SMD brackets, PCB boards, plug-in brackets, and filament brackets.

According to the bracket material, they are divided into copper brackets, iron brackets, BT substrates, aluminum substrates, ceramic substrates, etc.

According to the type of plating, it can be divided into copper-nickel-silver, chemical/electroplated nickel-gold, electroplated soft gold, nickel-palladium-gold, chemical tin, OSP, etc. UINCH (microinch/mile) is a unit, 1U'≈0.0254um.

LED chip, also known as LED light-emitting chip, is a solid-state semiconductor device and the core component of LED display device, namely P-N junction. Its main function is to convert electrical energy into light energy, and the main material is single crystal silicon. The semiconductor chip is composed of P-type semiconductor (hole-dominated) and N-type semiconductor (electron-dominated), and a P-N junction is formed when connected. When the current acts on the chip through the wire, the electrons are pushed to the P area, recombine with the holes, and emit energy in the form of photons. This is the principle of LED light emission.

LED chip incoming labels usually indicate parameters: Type (product series), dominant wavelength WLD (in nm), brightness LV (in mcd or mW), voltage VF (in V), including Min (minimum value), Avg (average value), Max (maximum value), Std (standard deviation).

LED chips can be classified in many ways: by color, they are divided into red (R), green (G), and blue (B), with wavelengths ranging from 620 to 760nm, 492 to 577nm, and 435 to 480nm.

According to the chip arrangement, they are divided into round chips and square chips.

According to the chip structure, they are divided into vertical structure (single electrode) and horizontal structure (double electrode). According to size, they are mainly divided into red light 3.2mil, 3.5mil, 4.2mil, and blue-green light 45mil, 46mil, 56mil, 810mil, etc. Mil is a unit of length, 1mil≈25.4um.

The function of bonding glue is to bond the chip to the designated area of the bracket for fixing and conducting electricity. It is divided into conductive glue and insulating glue. Vertical structure red light usually uses conductive glue, and horizontal structure blue-green light uses insulating glue. Bonding glue is the core part of bonding LED chips to brackets, and its quality directly determines the heat dissipation performance of LEDs. Kinglight Jingtai LED uses high-quality bonding glue, which has the advantages of good conductivity, good thermal conductivity, good yellowing resistance, high reliability, high bonding and shear strength, and no moisture absorption.

Also known as crystal wire, it is a material that connects LED brackets and chips and transmits electrical signals. It is an indispensable core material for semiconductor production. According to the material classification, there are gold wire, silver wire, copper wire, aluminum wire, palladium-plated copper wire, alloy wire, etc.; according to the wire diameter classification, there are 0.7mil, 0.8mil, 0.9mil, 1.0mil and other specifications.

Encapsulation glue is used to protect the chip and the internal structure of the frame from the external environment. After sealing, it plays a role in waterproofing, moisture-proofing, dust-proofing and provides excellent optical properties. Encapsulation glue generally includes epoxy resin, silicone and modified materials.

Epoxy resin: The advantages are high light transmittance, excellent bonding performance, good mechanical properties, good electrical insulation and sealing performance, low cost and easy molding; the disadvantages are high temperature resistance to yellowing and poor weather resistance.

Silicone: The advantages are high transparency, high and low temperature resistance, good weather resistance and thermal stability; the disadvantage is poor adhesion to the LED bracket.

Modified material: Encapsulation glue with improved comprehensive performance through physical blending or chemical modification. Physical blending is to mix silicone resin prepolymer and epoxy resin prepolymer, add curing agent to cure and shape, but the blended materials have poor compatibility and are easy to separate. Chemical modification is to introduce epoxy groups into silicone resin to improve mechanical properties and adhesion.

Through a detailed understanding of the various raw materials in LED packaging, we can better grasp the technical points and quality control of LED packaging. Different raw materials play their own unique roles in LED packaging. Choosing the right raw materials is crucial to improving the performance and reliability of LED products. With the continuous advancement of technology, it is believed that LED packaging raw materials will continue to innovate and optimize, providing stronger support for the development of LED display technology.